IGBT Module Thermal Management Overview
As insulated gate bipolar transistors (IGBT) evolve towards higher power and greater integration, significant improvements have been made in both structure and performance. However, the issue of heat generation has become increasingly prominent, with growing demands for effective heat dissipation. The IGBT chip, as the core functional component that generates heat, is at the center of this challenge, and the accumulation of heat can severely affect the device’s performance.
Therefore, it is crucial to effectively monitor and manage the temperature of IGBT modules.
This artical reviews the current research status, hot topics, and heat dissipation technologies related to IGBT modules, focusing on both active and passive cooling methods, the thermal resistance network system of IGBT power modules, the main steps in designing heat dissipation systems, and strategies to reduce thermal resistance for enhanced heat dissipation.
IGBT（insulated gate bipolar transistors ） power semiconductor modules, as key components in new energy conversion systems and high-voltage power switching devices, represent a new type of power semiconductor with field-control and self-shutdown capabilities.
These modules are widely used in fields such as lighting, automobiles, and high-speed rail. The next decade is considered the golden period for the development of IGBT power modules, which dominate medium to high-power applications at higher frequencies. Currently, no other products have been found to replace the essential role of IGBT power semiconductor modules in power electronic devices. One major weakness of IGBT power modules is their susceptibility to overvoltage and overheating.
Therefore, their ability to handle heat limits their application in high-power scenarios.
IGBT combines the advantages of metal-oxide-semiconductor field-effect transistors (MOSFET) and bipolar junction transistors (BJT), offering simple drive circuits, low steady-state losses, and strong short-circuit tolerance. The performance and parameters of IGBT power modules have significantly improved, making them more suitable for power electronic devices.
They are among the most representative platform devices in high-power semiconductors and can greatly improve motor drive efficiency.
As one of the core components of power electronic control circuits, IGBT has driven the rapid development of power electronics and has been widely applied in industries such as metallurgy and renewable energy, contributing to the global shift towards sustainable clean energy and addressing the fossil energy crisis and environmental issues.
However, as a key component in high-power converters, the thermal flux density of IGBT tends towards high power and high integration.
Due to its high-frequency conduction and switching, large amounts of heat are continuously generated, affecting the performance of the device.
Most failures of IGBT power semiconductor modules are related to heat. Without effective heat dissipation, the module temperature will quickly reach or exceed the junction temperature (150°C), severely impacting the IGBT’s operational performance, safety, and reliability.
This results in deteriorating performance indicators such as switching-off speed, on-state voltage drop, current tailing time, voltage spikes during turn-off, and increased losses.
Excessive temperature can even lead to damage to the entire device or system module, posing a serious threat to the safety and reliability of IGBT. To meet the growing demand for IGBT applications, capacity and reliability have become major challenges for IGBT devices. Similar to other electronic devices, an efficient, stable, convenient, and compact cooling system is crucial for the design of IGBT devices, ensuring their safe and stable operation. Thermal management design for IGBT power devices is a necessary and effective approach to address heat dissipation issues in IGBT modules.
This artical provides a comprehensive overview of the current domestic and international research status, hot topics, and heat dissipation technologies in IGBT power module thermal management. It offers valuable insights and serves as an important reference for solving heat dissipation design issues in IGBT modules, laying the theoretical foundation for the reliability design and optimization of device thermal performance.
