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Vapor Chamber Heat Sink

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Vapor Chamber

Fundamental Principles of Vapor Chambers

vapor chamber (VC), also known as a vapor chamber heat spreader, is a high-efficiency thermal management device based on liquid phase-change principles. It typically consists of a vacuum-sealed enclosure with microstructured surfaces, containing a working fluid such as water, ethanol, or ammonia. When thermal energy is applied to one end of the chamber, the working fluid undergoes rapid evaporation at the heated region, absorbing substantial latent heat. The resultant vapor diffuses uniformly throughout the cavity and condenses upon contacting cooler regions, releasing the stored thermal energy. The condensed liquid then returns to the heat source through capillary action facilitated by the microstructured wicking channels, completing the continuous phase-change cycle.

The characteristics of the uniform temperature plate

1.Efficient Heat Dissipation

Through liquid phase change, the vapor chamber enables rapid heat transfer from the heat source to the entire surface, achieving highly efficient thermal dissipation.

2.Uniform Temperature Distribution

The vapor chamber evenly distributes heat across its surface, preventing the formation of hotspots and enhancing device reliability and service life.

3.Lightweight Design

With a compact structural design and reduced weight, the vapor chamber is ideal for weight-sensitive electronic applications.

4.Rapid Thermal Response

The vapor chamber quickly adapts to temperature fluctuations, delivering immediate thermal management to ensure devices rapidly return to safe operating temperatures under sudden high-temperature conditions.

Hear Pipe Heat Sink

3DVC

Liquid Cold Plate

Copper Tube

Vapor Chamber Heat Sink

The heat sink vapor chamber utilizes the principle of phase change to efficiently transfer heat. When heat is transferred to the vapor chamber’s evaporator zone, the heat source warms the copper mesh micro-evaporator. The working fluid inside the chamber heats up under specific vacuum conditions and evaporates into gas. The gas-phase working fluid flows rapidly throughout the chamber due to the pressure difference. As the heated air rises, it reaches the cooling source at the top of the heat sink and releases its heat, condensing back into liquid.

The condensed liquid then flows back through the copper micro-capillary tubes to the bottom of the uniform heat spreader, where it returns to the evaporator zone. The returning liquid is reheated in the evaporator, vaporizing again and absorbing heat through the copper mesh micro-tubes. This continuous cycle within the chamber ensures the effective and sustained heat transfer and dissipation, making the vapor chamber heat sink an ideal solution for high-performance cooling needs.

For specialized applications, a custom heat sink can be designed to meet unique thermal management requirements, optimizing the efficiency and reliability of heat dissipation in various electronic devices.

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